Thermal Analysis

  • Ash Content
  • Crystallization Point
  • Cure Factor (IPC-TM-650 2.4.25D)
  • Cure Temperature
  • Curing Kinetics
  • Decomposition Temperature (Td) (ASTM D3850, IPC-TM-650
  • Deflection Under Flexural Load
  • Degree of Cure
  • Dropping Point
  • Eutectic Temperature
  • Gel Time
  • Glass Transition Temperature (Tg) (ASTM D3418; ASTM E1356; ASTM E1545; IPC-TM-650 2.4.24,, 2.4.25D)
  • Heat Capacity
  • Heat Distortion
  • Heat of Fusion
  • Lead-free (Pb-free) testing
  • Material Characterization
  • Melting Point
  • Outgassing / Outgas Testing (ASTM E595, ASTM E 595, NASA SP-R-0022A, ECSS-Q-ST-70-02, IPC-TM-650 2.4)
  • Phase Transition Temperature
  • Reaction Kinetics
  • Rubber Analysis
  • Slip Point of Fats
  • Softening Point
  • Solidification Point
  • Specific Heat
  • Time to Delamination (IPC-TM-650
  • Total Mass Loss (TML) and Collected Volatile Condensable Materials (CVCM) from Outgassing in a Vacuum Environment
  • Vicat Softening Temperature (ASTM D1525)
  • CTE (Coefficient of Thermal Expansion) by TMA (ASTM E831, IPC-TM-650 2.4.24)
  • CTE of Surface Layer by Strain Gauge Method
  • DSC (Differential Scanning Calorimetry) (ASTM D3418, ASTM E1356)
  • TGA (Thermogravimetric Analysis) (ASTM D3850)
  • TMA (Thermomechanical Analysis) (ASTM E831, ASTM E1545)

A view of multiple testing stations for use in conducting Thermal Analysis on various materials. This is one of several areas assigned to various thermal tests.

Differential Scanning Calorimetry (DSC) is used to determine specific heat, thermal effect, purity, polymorphism, glass transistion, oxidative stability, chemical reactions, reaction kinetics, melting behavior, and crystallization.

Thermogravimetric Analysis (TGA) techniques are used to determine filler content, and to determine the temperature and course of decomposition as they relate to weight loss at elevated temperatures.

Thermomechanical Analysis (TMA) determines the softening bahavior of polymers, the coefficient of linear expansion (CTE), glass transition temperature (Tg), shrinkage behavior, and changes in dimension caused by chemical reactions.

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